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June 9, 2026 · The Design Technology Co-Optimization (DTCO) collaboration focuses on optimizing tools, flows, and methodologies to deliver performance, power, and area (PPA).
June 5, 2026 · Engineers can respond instantly to design changes, evaluate multiple variants, and maintain consistent mesh quality.
April 23, 2026 · Developing “agent‑ready” digital and analog flows that integrate agentic AI.
April 20, 2026 · Integration of Google’s Gemini models with Cadence ChipStack AI Super Agent accelerates agent-driven design automation.
March 17, 2026 · New agentic integrated circuit (IC) and physical AI accelerated solutions enable engineers to solve previously impossible chip, system and AI factory challenges.
February 24, 2026 · Complementary technologies combine to deliver physical system design and AI-driven analysis solutions.
February 11, 2026 · The Cadence ChipStack AI Super Agent is an agentic workflow for automating chip design and verification.
September 26, 2025 · Purpose of collaboration is to power innovations using AI Flows and IP for TSMC advanced nodes and 3DFabric.
September 5, 2025 · Solutions to complement Cadence’s system analysis portfolio for automotive, aerospace, industrial and robotics, Cadence notes.
May 20, 2025 · At COMPUTEX, NVIDIA unveiled new hardware, software and services to speed the transition to enterprise AI factories.
May 8, 2025 · Cadence Cerebrus AI Studio is a SoC agentic AI design implementation tool.
May 8, 2025 · Cadence products incorporate agentic AI into its tools to optimize throughput and accuracy, the company says.
March 24, 2025 · NVIDIA GTC in San Jose featured notable faces, including Pat Gelsinger, former Intel CEO, and Michael Dell, founder and CEO of Dell paying homage to NVIDIA for paving the way in graphics and AI.
March 21, 2025 · The convergence of electrical and mechanical simulation is opening up new avenues for innovation.
August 8, 2024 · Designing for The America’s Cup Race
June 4, 2024 · Cadence continues to expect BETA CAE to contribute about $40 million to its 2024 revenue.
April 2, 2024 · Product intended to Improve energy efficiency with accurate and fast AI-driven digital twins.
March 5, 2024 · Purchase to allow for expansion into structural analysis.
February 23, 2024 · Partnerships aim at enabling heterogeneous integration with EMIB packaging technology.
February 19, 2024 · SolidWorks CEO Manish Kumar Outlines Strategies for User Community at 3DEXPERIENCE World
Digital Engineering June 2026
In the latest issue of Digital Engineering, we focus on automotive design innovations, including light and sound simulation, additive manufacturing applications. Our editors head to NVIDIA GTC and RAPID+TCT, and we investigate whether you can…
May 2026 Special Focus: Artificial Intelligence in Design and Simulation
In this Special Focus Issue, learn about the latest developments in the integration of artificial intelligence into engineering workflows.
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