Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.
Design & Simulation Software Guide 2025
In this Special Issue, Digital Engineering presents its second annual guide to design and simulation software vendors.
Special Focus Issue: Artificial Intelligence in Simulation
In this Special Focus Issue of Digital Engineering, we look at the latest trends in integrating AI and machine learning with design and simulation tools. The issue includes features on synthetic data, open-source AI for modeling, AI-powered…
ANSYS has entered into a definitive agreement to acquire Helic, provider of electromagnetic crosstalk solutions for systems on chips (SoCs). The acquisition of Helic, combined with ANSYS' flagship electromagnetic and semiconductor solvers, will provide a solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis, according to ANSYS.
The transaction is expected to close in the first quarter of 2019. Management will provide further details regarding the transaction and its impact on the 2019 financial outlook after the closing.
Helic's solutions reportedly help top semiconductor companies debug and analyze electromagnetic crosstalk issues in their advanced SoC designs and reduce the risk of silicon failure. When combined with ANSYS' solutions for electromagnetics and power-integrity noise analysis, engineers can deploy an electromagnetic-aware design methodology to design devices in all advanced nodes, optimize the die size and precisely capture electromagnetic and parasitic effects from direct current up to 110 GHz.
Its product suite includes electromagnetic modeling and simulation for complex circuits for sub-10 nanometer technologies. Helic products have been deployed by worldwide customers in applications ranging from radio-frequency wireless transceivers, graphics processing units, high-speed I/Os in multi-core processors and image sensors and other Internet of Things connected devices.
"Electromagnetic noise is a key design challenge that is driving the need for extensive on-chip electromagnetic analysis," says John Lee, ANSYS vice president and general manager.
"Helic is thrilled to become part of the ANSYS family. This acquisition will bring significant benefits to both ANSYS and Helic customers," says Yorgos Koutsoyannopoulos, president and CEO of Helic. "ANSYS customers will gain easy access to on-chip electromagnetics solvers, integrated with the flagship ANSYS electronics and semiconductor tools. Helic customers will benefit from inclusion in the ANSYS platform for multi-physics and chip-package-system."
Sources: Press materials received from the company and additional information gleaned from the company’s website.
DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].
Follow DE
Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.
About Us · Contact Us · Editorial Team · Advertising · Privacy Policy · Subscriber Services · © 2026 Digital Engineering 24/7 · Peerless Media