Siemens has signed a strategic framework agreement with the European Chips Joint Undertaking (Chips JU). The goal of Chips JU is reportedly to advance Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
This collaboration grants companies accepted into the Chips JU program access to Siemens’ electronic design automation (EDA) software under pre-defined pricing and conditions.
“The agreement significantly lowers barriers for smaller companies, startups and research institutions to access world-class design, verification and manufacturing software— the same powerful tools used by industry giants. This creates a more level playing field for innovation within the European semiconductor ecosystem,” says Jean-Marie Saint Paul, senior vice president, EDA Global Sales, Siemens EDA, Siemens Digital Industries Software.
“The contract with Siemens is a key enabler for our Design Platform” says Jari Kinaret, the Executive Director of the Chips Joint Undertaking. “The Design Platform is an essential part of the capacity build-up under the Chips Act, helping European startups and SMEs to develop into profitable fabless businesses.”
The collaboration enables EuroCDP participants to:
To learn more about Siemens’ work with the EuroCDP to the European Chips Act's goals, visit https://eurocdp.eu/
Sources: Press materials received from the company and additional information gleaned from the company’s website.


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