SSP 2.0 from Modelica Released

The System Structure & Parameterization (SSP) standard has established itself as a format for the exchange of composite system simulation models and simulation model architectures. SSP version 2.0, now released by the Modelica Association, is a milestone for the standard with new features that enable the use of FMI 3.0 and Modelica components, and the exchange of abstract simulation model architectures.

These new features help improve support for new use cases: advanced co-simulation, virtual Electronic Control Units (vECUs), the next generation of digital twins, artificial intelligence, and autonomous driving applications.

SSP 1.0 is recognized as an adopted format for the exchange of composite system simulation models incorporating interconnected component models in the adopted FMI standard for the exchange of individual models. The royalty-free nature of Modelica Association standards, as well as their harmonized development and availability of open-source and commercial solutions from the first publication have contributed to their adoption across many industries: automotive, aerospace, industrial equipment, buildings, energy, manufacturing, and others.

The development of SSP 2.0 has been guided by the needs of new use cases, the experience from current end users and developers, as well as the parallel development of the FMI 3.0 standard.

Major advances are the following:

Architecture Exchange. Where SSP 1.0 focused on the executable simulation system as the point of interchange, SSP 2.0 enhances support for the exchange of architectural specifications, and their incremental refinement in collaborative development processes.

Advanced Co-Simulation. New technical features in SSP 2.0, based on corresponding new features in FMI 3.0 enable co-simulation of complex systems of models. 

Broader Component Support. SSP 1.0 supported FMI-based components out of the box, with SSP 2.0 adding direct support for Modelica-based components, as well as support for both causal and acausal connection semantics, and mapping of structured interface types to binary connectors. 

• Digitalization of the development process is the goal to improve efficiency in product development, especially with embedded software, Modelica reports. Virtual Electronic Control Units (vECUs) help to achieve that for embedded software development. SSP 2.0 adds support for the interconnection of FMI 3.0-based full-fledged vECUs into overall cyber-physical systems.
• Layered Standards and Meta Data. The concept of “Layered Standards”, introduced with SSP 1.0, and now more widely adopted in FMI 3.0, allows users to embed artifacts from other standards within the SSP container in a systematic way. SSP 2.0 widens this support, especially in the areas of meta data and digital signature standards, greatly improving standards interoperability.
• Next-Generation Digital Twins. FMI is a great format for component and system-level digital twins, executed in the cloud or at the edge. SSP 2.0 brings this support to the level of systems within systems, with features that enable the embedding of additional content.

For those interested in the added technical features that SSP 2.0 offers over SSP 1.0, see the change description in the SSP 2.0 specification, and the release notes.

About the Modelica Association

The Modelica Association (MA) is a non-profit organization incorporated in Sweden with the mission to develop open-access, royalty-free, coordinated standards for the development and verification of cyber-physical systems. The open and royalty-free nature of the standards supports an eco-system of open-source and commercial solutions.

Sources: Press materials received from the company and additional information gleaned from the company’s website.