Digital Engineering 24/7

Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.

Industry Founds Gen-Z Consortium

Latest Engineering Computing News

Latest Engineering Computing Resources

By DE Editors  

October 11, 2016

A group of technology companies has formed the Gen-Z Consortium, an industry alliance working to create and commercialize a new scalable computing interconnect and protocol. This flexible, high-performance memory semantic fabric provides a peer-to-peer interconnect that easily accesses large volumes of data while lowering costs and avoiding today’s bottlenecks, a press release states.

Alliance members include AMD, ARM, Cavium Inc., Cray, Dell, EMC, Hewlett Packard Enterprise (HPE), Huawei, IBM, IDT, Lenovo, Mellanox Technologies, Micron, Microsemi, Red Hat, Samsung, Seagate, SK Hynix, Western Digital Corporation and Xilinx.

The consortium states that it provides:

Gen-Z provides the following benefits:

  • High Bandwidth, Low Latency: Simplified interface based on memory semantics, scalable from tens to several hundred GB/s of bandwidth, with sub-100 ns load-to-use memory latency.
  • Advanced Workloads and Technologies: Enables data centric computing with scalable memory pools and resources for real-time analytics and in-memory applications. Accelerates new memory and storage innovation.
  • Compatible and Economical: Highly software compatible with no required changes to the operating system. Scales from simple, low cost connectivity to highly capable, rack scale interconnect
“AMD is committed to open ecosystems for technology development and is excited to join the rest of the Gen-Z members today in announcing this significant step. The need for high-bandwidth, low-latency access to memory and storage as well as rack-scale composability in the datacenter is growing rapidly. Gen-Z is an advanced, modern protocol designed to deliver a high-performance, cross-platform solution that can serve its members and their customers far into the future,” said Mark Papermaster, chief technology officer and senior vice president of Technology and Engineering at AMD.

For more information, visit Gen-Z.

Sources: Press materials received from the company and additional information gleaned from the company’s website.

 

Latest in Hewlett Packard

About DE Editors

DE Editors

DE's editors contribute news and new product announcements to Digital Engineering. Press releases may be sent to them via [email protected].

Follow DE
on Facebook
on Linkedin

Related Topics

Engineering Computing   News   AMD   Cray   Dell   Engineering Computing   Hewlett Packard   Lenovo   All topics
 

Subscribe

Subscribe to our FREE magazine, FREE email newsletters or both!

Join over 90,000 engineering professionals who get fresh engineering news as soon as it is published.

Subscribe today

 
 

From our Sponsors

Meltio Takes Metal Additive to the Next Level
Meltio's DED technology enables industries to tailor and customize their solutions to create & repair metal parts.
Easing the Transition from ETO to CTO with Configuration Lifecycle Management
Manufacturers are discovering that the Configure-to-Order (CTO) model provides significant benefits when it comes to customization.
Siemens + Altair = The Next Chapter in Design and Simulation
With its acquisition of Altair, Siemens creates a unified simulation portfolio combining generative design with high-performance computing and AI workflows.