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Helping design and engineering professionals discover, evaluate and specify technologies and processes that shorten the design cycle and enable success.

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SME, Stratasys Name 2017 SkillsUSA Competition Winners

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DE Editors · July 18, 2017 · Now in its third year, the 2017 Additive Manufacturing Competition consisted of 34 high school and post-secondary student teams competing for a chance to take home gold, silver or bronze medals.

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Digital Engineering, July 2017

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DE Editors · July 1, 2017 · Inside this issue The NODE Under the Blade’s Hood California startup proposes 3D-printed chassis assembly as an environmentally friendly alternative. Going Virtual with the BOXX ProVDI 841OR-V Our hands-on review answers the question of whether VDI is right for you. GPU Splitting Leads to Lighter, Nimbler VDI Honda…

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Digital Engineering, June 2017

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DE Editors · June 1, 2017 · Inside this issue Flying on Water The America’s Cup charts new waters in technology-driven racing design. It Takes Tech & Teamwork How America’s Cup teams integrate design, simulation, optimization, 3D printing, data analysis and high-performance computing technology for any advantage. Review: Happy Birthday, AutoCAD After 35 years, AutoCAD…

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Petaflop Performance

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DE Editors · May 24, 2017 · MIT Lincoln Laboratory Supercomputing Center unveils Intel-based Dell EMC system to accelerate the nations’ research needs.

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Watch This: University of Pisa Simplifies HPC with Intel and Dell

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DE Editors · May 24, 2017 · Intel® HPC Orchestrator simplifies the installation, management, and ongoing maintenance of an HPC system.

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Dell EMC & Intel to Give Supercomputer a 5 Petaflop Boost

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DE Editors · May 24, 2017 · The partners will expand upon their experience with the EU-funded Dynamical Exascale Entry Platform (DEEP) and DEEP-ER (Extended Reach) projects to augment JSC’s JURECA cluster with a highly scalable component.

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RAPID + TCT 2017: 3D Printing Alliances Build Bridges to the Future

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DE Editors · May 12, 2017 · RAPID+TCT taps into 3D printing trends, manufacturing updates and new technologies at latest annual conference.

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Preview of RAPID+TCT 2017

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DE Editors · May 3, 2017 · Rapid + TCT will take place May 8-11, 2017 in Pittsburgh, PA at the David L. Lawrence Convention Center.

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Digital Engineering, May 2017

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DE Editors · May 1, 2017 · Inside this issue 3D Printing Prep Gets into Shape Preparing models for 3D printing is no longer heavy lifting, but it’s still not as simple as it looks. Dealing with Stress Concentrations and Singularities It’s good know the stress peaks and distribution of high stresses, but it’s better…

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A Spacewalk on Mars with 3D Printed Technology

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DE Editors · May 1, 2017 · High-precision, low-weight and strength attributes can help determine the success of a mission to Mars. 3D printing solutions can meet all these requirements.

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Transforming Ankle Foot Orthosis with 3D Printing

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DE Editors · May 1, 2017 · With the help of large-format 3D printing technology via 3D Platform and research conducted by students at Gonzaga University, patients may soon be able to count on 3D printed orthotics that are affordable and produced in a timely fashion.

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Dell Unveils Entry-level Wyse 3040 Thin Client

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DE Editors · April 10, 2017 · Dell reports that its new Wyse 3040 Thin Client is its lightest, smallest and most powerful in the entry-level class.

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PVComplete Rolls Out PVCAD

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DE Editors · April 4, 2017 · PVCAD is set up to offer precise solar engineering, as well as an ability to iterate your designs and compare which one is right for each project, according to PVComplete.

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3D Platform Enhances Workbench Pro 3D Printer

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DE Editors · April 4, 2017 · 3D Platform’s newest WorkbenchPro, a large-format industrial-strength 3D printer, is replete with new features.

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Digital Engineering, April 2017

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DE Editors · April 1, 2017 · Inside this issue Preconfigured HPC for Simulation Specialized middleware, license negotiations and workflow management tools distinguish turnkey HPC vendors. Designing Online with Onshape Onshape’s cloud CAD solution links engineering teams in new ways. A New Name and A New Look AMD releases new Radeon Pro WX series of…

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Moldex3D Links 3D Simulation with LS-DYNA Draping Analysis

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DE Editors · March 14, 2017 · The composites molding process mentioned here is called two-step over molding.

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Luxoft Launches Symtavision 4.0

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DE Editors · March 13, 2017 · Symtavision 4.0 adds new function-level timing analysis and ethernet network analysis upgrades including SOME/IP and worst-case AVB analysis.

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Digital Engineering, March 2017

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DE Editors · March 1, 2017 · Inside this issue Too Hot to Handle, Too Bright to Watch Thermal simulation of wearables must tackle tight corners, personal preferences and interdisciplinary communication issues. Out of Classroom Curriculum Student competitions prepare up-andcomers with the hands-on experience necessary to meet the challenges of next-generation engineering. Understanding Load Paths…

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ANSYS Introduces ANSYS 18.0

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DE Editors · February 3, 2017 · The software has tools for digital twins and simulation apps.

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Sensirion Releases SFP800 Series

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DE Editors · February 3, 2017 · The series offer repeatability and measurement speed up to 2kHz.

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